3D Integrated Modules for RF and mm-wave applications
3-Pole Cavity Band Pass Filters using LTCC
Simulation & Measurement Results
Integration (Filter + Antenna)
Simulation & Measurement Results

Completed Research

Surface Micromachining

Low loss and low power consumption
Eliminate dielectric loss
- Loss is high in V-band
Previously developed modules
- Vertical monopole
- Vertical Yagi-Uda
- Elevated patch antenna
- Elevated coupler

Enabling Technology - Polymer core conductor

High-Q elevated Cavity resonator

2-pole surface micromachined waveguide filter

V-Band Prototype III

4-pole transmission zero filter

Introducing transmission zeros improves filter selectivity

Four-cavity filter structure
Top plate not shown for clarity
(Patent pending)

Introducing two paths to create transmission canceling at certain frequencies

UWB antennas on flexible organic substrates

The objective of this research is the design and development of novel compact UWB antennas with omni-directional radiation patterns and good matching along the whole UWB range (3.1-10.6 GHz) that can be used for hand-held devices for personal communications. Polygon monopoles, elliptical monopoles and elliptical slot antennas are used to meet various required specifications.

All the presented antennas are fabricated on Liquid Crystal Polymer (LCP) (εr=3, tanδ=0.002) and were tested in non-planar shapes to investigate their potential use in different applications like wearable electronics.

Polygon Antenna

Return Loss

Antenna mounted on Cylinder

Elliptical Antenna

CPW feeding - Impedance matching technique

Return Loss

Radiation Patterns

U-fed Elliptical Slot

CPW feeding - Impedance matching technique

Return Loss

Antenna mounted on Cylinder

3-D Radiation Patterns

3D Integrated Modules for RF and mm-wave applications

Considering the importance of broadband and high-data rate (> 2 Gb/s) wireless services such as a high-speed internet, real-time video streaming, high-definition television (HDTV), wireless Gigabit Ethernet and automotive sensor, wireless communication systems call upon miniaturization, portability, cost-saving and performance improvement to satisfy the specifications of the next generation multi-gigabit per second wireless transmission. The 3-D integration approach using multilayer technologies, such as LTCC and LCP, has emerged as an attractive solution for these systems due to its high level of compactness and mature multilayer fabrication capability.

In this research, we design, analyze and optimize 3D millimeter-wave (mm-W) modules in multilayer substrates. It includes the design of integrated interconnects, distributed passives and antennas for applications up to 100 GHz. The optimal integration of mm-W passives into a 3-D front-end module is researched to improve package efficiency and electrical high-frequency performance and to eliminate a separate package for passives, yielding the lower cost, reduced profile and weight.