1. Bushyager N., Staiculescu D., Martin L., Lee J., Vasiloglou N., Tentzeris M.M. - Design and Optimization of 3D RF Modules, Microsystems and Packages Using Electromagnetic and Statistical Tools Proc. of the 2004 IEEE-ECTC Symposium, pp.1412-1415, Las Vegas, NV, June 2004.
  2. Kawano K., Miura N., Kuroda M., Tentzeris M.M. - A Novel Numerical Approach for the Analysis of MEMS-Based Variable Capacitors with Moving Metallic Plates in Japanese;Asian Fonts required [pdf], The IEICE Transaction on Electronics, Vol. J87-C, No.1, pp32-38, January, 2004.
  3. Li R.L., DeJean G., Papapolymerou J., Laskar J., Tentzeris M.M. - FDTD Analysis of Microstrip Patch Antennas and Arrays on High Dielectric-Constant Substrate Surrounded by a Soft-and-Hard Surface IEEE Transactions on Magnetics, Vol.40, No.2, pp.1444-1447, March 2004.
  4. Kuroda M., Miura N., Tentzeris M.M. - A Novel Numerical Approach for the Analysis of 2D MEMS-Based Variable Capacitors Including the Effect of Arbitrary Motions Applied Computational Electromagnetics (ACES) Society Journal, Vol.19, No.1b, pp.133-138, March 2004.
  5. Li R.L., DeJean G., Laskar J., Tentzeris M.M. - Development and Analysis of a Folded Shorted-Patch Antenna with Reduced Size IEEE Transactions on Antennas and Propagation, Vol.52, No.2, pp.555-562, February 2004.
  6. Tentzeris M.M., Bushyager N. - Electromagnetics: Time-Domain Techniques Invited Chapter for the book "Encyclopedia of RF and Microwave Engineering", edited by K.Cheng, published by Wiley Eds., May 2004.
  7. Tentzeris M.M., Staiculescu D., Lim K., Pinel S., Laskar J., Tummala R. - RF/Wireless Packaging Invited Chapter for the book: "Encyclopedia of RF and Microwave Engineering", edited by K.Cheng, published by Wiley Eds., May 2004.
  8. Goswami J., Tentzeris M.M. - Wavelets and Electromagnetics Invited Chapter for the book: "Encyclopedia of RF and Microwave Engineering", edited by K.Cheng, published by Wiley Eds., May 2004.
  9. Bushyager N., Dalton E., Tentzeris M.M. - Modeling of Complex RF/Wireless Structures Using Computationally Optimized Time-Domain Techniques International Journal of Numerical Modeling, Vol.17, No.3, pp.223-236, May 2004.
  10. Papapolymerou J., Ponchak G., Dalton E., Bacon A., Tentzeris M.M. - Crosstalk Between Finite Ground Coplanar Waveguides over Polyimide Layers for 3D-MMIC's on Si Substrates IEEE Transactions on Microwave Theory and Techniques, Vol.52, No.4, pp.1292-1301, April 2004.
  11. Thompson D., Tantot O., Jallageas H., Ponchak G.E., Tentzeris M.M., Papapolymerou J. - Characterization of Liquid Crystal Polymer (LCP) Material and Transmission Lines on LCP Substrates from 30-110 GHz IEEE Transactions on Microwave Theory and Techniques, Vol.52, No.4, pp.1343-1352, April 2004.
  12. Tentzeris M.M., Laskar J., Papapolymerou J., Thompson D., Pinel S., Li R.L., Lee J.H., DeJean G., Sarkar S., Pratap R., Bairavasubramanian R., Papageorgiou N. - RF SoP for Multi-band RF and Millimeter-wave Systems Advanced Packaging Magazine, pp.15-16, April 2004.
  13. Tummala R., Swaminathan M., Tentzeris M.M., Laskar J., Chang G.K., Sitaraman S., Keezer D., Guidotti D., Huang Z., Lim K., Wan L., Bhattacharya S., Sundaram V., Liu F., Raj P.M. - The SOP for Miniaturized, Mixed-Signal Computing, Communication and COnsumer Systems of the Next Decade IEEE Transactions on Advanced Packaging, Vol.27 No.2, pp.250-267, May 2004. 2004 IEEE Transactions on Advanced Packaging Commendable Paper Award.
  14. Tentzeris M.M., Laskar J., Papapolymerou J., Pinel S., Palazzari V., Li R.L., DeJean G., Papageorgiou N., Thompson D., Bairavasubramanian R., Sarkar S., Lee C.H. - 3D Integrated RF and Millimeter-Wave Functions and Modules Using Liquid Crystal Polymer (LCP) System-on-Package Technology IEEE Transactions on Advanced Packaging, Vol.27 No.2, pp.332-340, May 2004.
  15. Lee J., Bushyager N., Tentzeris M.M. - Comparative Evaluation of DSP Techniques Coupled with EM Time-Domain Simulators for the Efficient Modeling and Design of Highly Resonant RF-MEMS Structures IEEE Microwave and Wireless Components Letters, Vol.14, No.7, pp.361-363, July 2004.
  16. Li R.L., DeJean G., Lim K., Tentzeris M.M., Laskar J. - Design of Compact Stacked-Patch Antennas in LTCC Multilayer Packaging Modules for Wireless Applications IEEE Transactions on Advanced Packaging, Vol.27, No.4, pp.581-589, November 2004.
  17. Pinel S., Tentzeris M.M., Staiculescu D., Lim K., Laskar J. - RF/Wireless Packaging Invited Chapter for the book "Encyclopedia of RF and Microwave Engineering", Wiley Eds., May 2004.