1. Pinel S., Lim K., Maeng M., Davis M., Li R.L., Tentzeris M.M., Laskar J. - RF System-on-Package (SOP) Development for compact low cost Wireless Front-end systems Proc. of the 2002 European Microwave Symposium, Milan, ITALY, September 2002, pp.I.61-64.
  2. Bushyager N., Tentzeris M.M. - Intracell Modeling of Metal/Dielectric Interfaces for EBG/MEMS RF Structures Using the Multiresolution Time-Domain Method Proc. of the 2003 ACES Conference, Monterey, CA, March 2003.
  3. Lee J., Dalton E., Bushyager N., Kunze M., Heinrich W., Tentzeris M.M. - Coupling of Electromagnetic Time-Domain Simulators with DSP/Subgridding Techniques for the Adaptive Modeling of Wireless Packaging Structures Proc. of the 2003 ACES Conference, pp., Monterey, CA, March 2003.
  4. Kuroda M., Miura M., Tentzeris M.M. - A Novel Numerical Approach for the Analysis of 2D MEMS-Based Variable Capacitors with Motion to Arbitrary Directions Proc. of the 2003 ACES Conference, Monterey, CA, March 2003.
  5. Al-Ahmad M., Coccetti F., Tentzeris M.M., Russer P. - Parametric Model Generation Algorithm for Planar Microwave Structures based on Full-Wave Analysis and Design of Experiment Proc. of the 2003 ACES Conference, Monterey, CA, March 2003.
  6. Bushyager N., Martin L., Khushrushahi S., Basat S., Tentzeris M.M. - Design of RF and Wireless Packages Using Fast Hybrid Electromagnetic/Statistical Methods Proc. of the 2003 IEEE-ECTC Symposium, pp.1546-1549, New Orleans, LA, May 2003.
  7. Dalton E., Kunze M., Heinrich W., Tentzeris M.M. - Accurate Modeling of Multilayer Packaging Structures with a Hybrid FDTD Method Proc. of the 2003 IEEE-ECTC Symposium, pp.1028-1031, New Orleans, LA, May 2003.
  8. Thompson D., Kirby P., Papapolymerou J., Tentzeris M.M. - W-Band Characterization of Finite Ground Coplanar Transmission Lines on Liquid Crystal Polymer (LCP) Substrates Proc. of the 2003 IEEE-ECTC Symposium, pp.1652-1655, New Orleans, LA, May 2003.
  9. Li R.L., DeJean G., Tentzeris M.M., Laskar J. - Integration of Miniaturized Patch Antennas with High Dielectric Constant Multilayer Packages and Soft-and-Hard Surfaces (SHS) Proc. of the 2003 IEEE-ECTC Symposium, pp.474-477, New Orleans, LA, May 2003.
  10. Bushyager N., Tentzeris M.M., Papapolymerou J. - Electromagnetic Band-Gap Structure Design Using a Composite-Cell Multiresolution Time-Domain Technique Proc. of the 2003 IEEE-IMS Symposium, pp.2081-2084, Philadelphia, PA, June 2003.
  11. Fujii M., Tentzeris M.M., Russer P. - Performance of Nonlinear Dispersive APML in High-Order FDTD Schemes Proc. of the 2003 IEEE-IMS Symposium, pp.1129-1132, Philadelphia, PA, June 2003.
  12. Kuroda M., Miura N., Kawano K., Tentzeris M.M. - Numerical Modeling of the Transient Behavior of MEMS Structures Involving Motion in Arbitrary Directions Proc. of the 2003 IEEE-APS Symposium, pp.I.359-362, Columbus, OH, June 2003.
  13. Pierantoni L., Farina M., Rozzi T., Coccetti F., Russer P., Bushyager N., Tentzeris M.M. - Comparison of Electromagnetic Solvers for the Analysis of LTCC Components Proc. of the 2003 IEEE-APS Symposium, pp.I.733-736 Columbus, OH, June 2003.
  14. Li R.L., DeJean G., Tentzeris M.M., Laskar J., Papapolymerou J. - LTCC Multilayer Based CP Patch Antenna Surrounded by a Soft-and-Hard Surface for GPS Applications Proc. of the 2003 IEEE-APS Symposium, pp.II.651-654, Columbus, OH, June 2003.
  15. Li R.L., DeJean G., Tentzeris M.M., Laskar J. - Novel Multiband Broadband Planar Wire Antennas for Wireless Communication Handheld Terminals Proc. of the 2003 IEEE-APS Symposium, pp.III.44-47, Columbus, OH, June 2003.
  16. Bushyager N., Tentzeris M.M. - Modeling of intracell metallic elements using the MRTD Technique Proc. of the 2003 IEEE-APS Symposium, pp.I.354-355, Columbus, OH, June 2003.
  17. Tentzeris M.M., Laskar J. - RF System-on-PAkage (SOP) Development for Compact Low-Cost Wireless Front-End Systems Proc. of the 2003 Interpack Conference and Exhibition, pp.19-24, Maui, HI, July 2003.
  18. Pinel S., Lim K., DeJean G., Li R.L., Lee C.H., Maeng M., Davis M., Tentzeris M.M., Laskar J. - System-on-package (SOP) Architectures for Compact and Low-cost RF Front-end Modules Proc. of the 2003 IEEE European Microwave Symposium, pp.I.307-310, Munich, GERMANY, October 2003.
  19. Zheng G., Kirby P., Rodriguez A., Papapolymerou J., Tentzeris M.M. Dunleavy L. - Design and On-Wafer Measurement of a W-Band Via-Less CPW RF Probe Pad to Microstrip Transition Proc. of the 2003 IEEE European Microwave Symposium, pp.I.443-446, Munich, GERMANY, October 2003.
  20. Bushyager N., Tentzeris M.M. - Composite Cell MRTD Method for the Efficient Simulation of Complex Microwave Structures Proc. of the 2003 IEEE European Microwave Symposium, pp.I.77-80, Munich, GERMANY, October 2003.
  21. Wang G., Abdolvand R., Ayazi F., Papapolymerou J. and Tentzeris M.M. - Finite Ground Coplanar Lines on CMOS Grade Silicon with a thick embedded Silicon Oxide Layer Using Micromachining Techniques Proc. of the 2003 IEEE European Microwave Symposium, pp.I.25-27, Munich, GERMANY, October 2003.
  22. Dalton E., Kunze M., Heinrich W., Tentzeris M.M. - A Hybrid FDTD Quasistatic Technique for the Accurate Modeling of Complex Integrated RF Structures Including the Effects of Lossy Metals Proc. of the 2003 IEEE European Microwave Symposium, pp.I.331-334, Munich, GERMANY, October 2003.
  23. Lim K., Davis M., Maeng M., Yoon S.W., Pinel S., Wan L., Guidotti D., Ravi D., Laskar J., Tentzeris M.M., Sundaram V., White G., Swaminathan M., Brook M., Jokerst N., Tummala R. - Development of Intelligent Network Communicator for Mixed Signal Communications Using the System-on-a-Package (SOP) Technology Proc. of the 2003 IEEE Asian Pacific Microwave Conference, pp.TD2_05, Seoul, KOREA, November 2003.
  24. Pinel S., Lim K., DeJean G., Li R.L., Lee C.H., Maeng M., Davis M., Tentzeris M.M., Laskar J. - Advanced 3D Integrated and Low Cost RF Wireless Systems Using System-on-Package (SOP) Architectures Proc. of the 2003 IEEE Asian Pacific Microwave Conference, pp.WA5_01, Seoul, KOREA, November 2003.
  25. Lee J., Lim K., Pinel S., DeJean G., Li R.L., Lee C.H., Davis M., Tentzeris M.M., Laskar J. - Advanced System-on-Package (SOP) Multilayer Architectures for RF/Wireless Systems up to Millimeter-Wave Frequency Bands Proc. of the 2003 IEEE Asian Pacific Microwave Conference, pp.FA5_01, Seoul, KOREA, November 2003.
  26. Ponchak G.E., Tentzeris M.M. - Finite Ground Coplanar Waveguide (FGC) Low Loss, Low Coupling 90-Degree Crossover Junctions IEEE Transactions on Advanced Packaging, Vol.25 No.3, pp.385-392, August 2002 2003 NASA Godfrey "Art" Anzic Collaborative Distinguished Publication.
  27. Lee C.H., Sutono A., Han S., Lim K., Pinel S., Laskar J., Tentzeris M.M. - A Compact LTCC-based Ku-band Transmitter Module IEEE Transactions on Advanced Packaging, Vol.25 No.3, pp.374-384, August 2002.
  28. Staiculescu D., Laskar J., Tentzeris M.M. - Design of experiments (DOE) technique for microwave/millimeter wave flip-chip optimization International Journal of Numerical Modeling, Vol.16, pp.97-103, 2003.
  29. Tentzeris M.M. - Full-Wave Methods for the Analysis, Modeling and Design of RF and Microwave Geometries Invited Chapter for the book: "The RF/Microwave Applications: Challenges and Solutions", edited by M.Golio, pp.18.1-18.32, CRC Press, June 2003.
  30. Zheng G., Papapolymerou J., Tentzeris M.M. - Wideband Coplanar Waveguide RF Probe Pad to Microstrip Transitions without Via Holes IEEE Microwave and Wireless Components Letters, Vol.13, No.12, pp.544-546, December 2003.
  31. Ponchak G.E., Tentzeris M.M., Papapolymerou J. - Coupling Between Microstrip Lines Embedded in Polyimide Layers for 3D-MMIC's on Si IEE Proceedings, H Microwaves, Antennas, and Propagation, Vol. 150, No. 5, pp.344-350, October 2003.
  32. Pratap R.J., Pinel S., Staiculescu D., Laskar J., May G. - A Neural Networ Model for Sensitivity Analysis of Circuit Parameters for Flip-Chip Interconnects Proc. of the 2003 ECTC Conference, New Orleans, LA, May 27-30, 2003, pp. 1619-1625.