1. Bushyager N., Dalton E., Papapolymerou J., Tentzeris M.M. - Modeling of Large Scale RF-MEMS Circuits Using Efficient Time-Domain Techniques Invited Paper, 2002 ACES Conference, Monterey, CA, pp.49-54.
  2. Kuroda M., Kawano K., Tentzeris M.M. - Body Fitted Grid Generation Method with Moving Boundaries and its Application to the Analysis of MEMS Proc. of 2002 ACES Conference, Monterey, CA, pp.219-224.
  3. Bushyager N., Davis M., Dalton E., Laskar J., Tentzeris M.M. - Q-Factor Prediction and Optimization of Multilayer Inductors for RF Packaging Microsystems Using Time-Domain Techniques Proc. of the 2002 IEEE Electronic Components and Technology Conference, San Diego, CA, May 2002, pp.1718-1721.
  4. Bushyager N., Lange K., Tentzeris M.M., Papapolymerou J. - Modeling and Optimization of RF-MEMS Reconfigurable Tuners with Computationally Efficient Time-Domain Techniques Proc. of the 2002 IEEE-IMS Symposium, Seattle, WA, June 2002, pp.II.883-886.
  5. Ponchak G.E., Dalton E., Tentzeris M.M., Papapolymerou J. - Coupling Between Microstrip Lines with Finite Width Ground Plane Embedded in Polyimide Layers for 3D-MMIC's on Si Proc. of the 2002 IEEE-IMS Symposium, Seattle, WA, June 2002, pp.III.2221-2224.
  6. Papapolymerou J., Ponchak G.E., Tentzeris M.M. - A Wilkinson Power Divider on a Low Resistivity Si Substrate with a Polyimide Interface Layer for Wireless Circuits Proc. of the 2002 IEEE-IMS Symposium,, Seattle, WA, June 2002, pp.I.593-596.
  7. Pinel S., Chakraborty S., Roellig M., Kunze R., Mandal S., Liang H., Lee C.H., Li R.L., Lim K., White G., Tentzeris M.M., Laskar J. - 3D integrated LTCC module using uBGA technology for compact C-band RF front-end module Proc. of the 2002 IEEE-IMS Symposium, Seattle, WA, June 2002, pp.III.1553-1556.
  8. Davis M., Yoon S., Mandal S., Bushyager N., Maeng M., Lim K., Pinel S., Sutono A., Laskar J., Tentzeris M.M., Nonaka T., Sundaram V., Liu F., Tummala R. - RF-Microwave Multi-band Design Solutions for Multilayer Organic System on Package Integrated Passives Proc. of the 2002 IEEE-IMS Symposium, Seattle, WA, June 2002, pp.III.2217-2220.
  9. DeJean G., Li R.L., Tsai E., Tentzeris M.M.,Laskar J. - Novel Small Folded Shorted-Patch Antennas Proc. of the 2002 IEEE AP-S Symposium, San Antonio, TX, June 2002, pp.IV.26-29.
  10. Li R.L., Lim K., Maeng M., Tsai E., DeJean G., Tentzeris M.M., Laskar J. - Design of Compact Stacked-Patch Antennas on LTCC Technology for Wireless Communication Applications Proc. of the 2002 IEEE AP-S Symposium, San Antonio, TX, June 2002, pp.II.500-503.
  11. Bacon A., Ponchak G.E., Papapolymerou J., Bushyager N., Tentzeris M.M. - Folded coplanar waveguide slot antenna on silicon substrates with a polyimide interface layer Proc. of the 2002 IEEE AP-S Symposium, San Antonio, TX, June 2002, pp.II.432-435.
  12. Bushyager N., Dalton E., Tentzeris M.M. - Adaptive Modeling and Design of Packaging Microsystems and MEMS for Wireless Communication Modules General Assembly of URSI 2002, Maastricht, Netherlands, August 2002.
  13. Zheng G., Pinel S., Lim K., Li R.L., Tentzeris M.M., Papapolymerou J., Laskar J. - Design of Compact RF Components for Low-Cost High-Performance wireless Front-Ends Proc. of the 2002 ICMMT Symposium, Beijing, CHINA, August 2002, pp.259-262. Best Paper Award
  14. Ponchak G.E., Dalton E., Bacon A., Papapolymerou J., Tentzeris M.M. - Measured Propagation Characteristics of Finite-Ground Coplanar Waveguide on Silicon with a Thick Polyimide Interface Layer Proc. of the 2002 European Microwave Symposium, Milan, ITALY, September 2002, pp.I.167-170.
  15. Tentzeris M.M. - Adaptive modeling and design of highly integrated 3D microwave-millimeter wave radio front-ends Proc. of the 2002 Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, Monterey, CA, October 2002, pp.109-112.
  16. Tentzeris M.M., Bushyager N., Li R.L., Lim K., Davis M., Pinel S., Laskar J., Zheng E., Papapolymerou J. - Analysis of MEMS and Embedded Components in Multilayer Packages Using FDTD/MRTD for System-on-Package Applications Proc. of the 2002 Asian-Pacific Microwave Symposium, Kyoto, JAPAN, November 2002, pp.I.554-557.
  17. Tsai E., Bacon A.M., Tentzeris M.M., Papapolymerou J. - Design and Development of Novel Micromachined Patch Antennas for Wireless Applications Proc. of the 2002 Asian-Pacific Microwave Symposium, Kyoto, JAPAN, November 2002, pp.II.821-824.
  18. Kuroda M., Miura N., Tentzeris M.M. - A Novel Time-Domain Technique for the Analysis of MEMS-Based Variable Capacitors with Moving Metallic Parts Proc. of the 2002 Asian-Pacific Microwave Symposium, Kyoto, JAPAN, November 2002, pp.III.1208-1211.
  19. Laskar J., Tentzeris M.M., Lim K., Pinel S., Davis M., Rhagavan A., Maeng M., Yoon S., Tummala R. - Advanced System-on-Package RF Front-ends for Emerging Wireless Communications Proc. of the 2002 Asian-Pacific Microwave Symposium, Kyoto, JAPAN, November 2002, pp.III.1703-1708.
  20. Tentzeris M.M., Cangellaris A., Katehi L.P.B., Harvey J. - Multiresolution time-domain (MRTD) adaptive schemes using arbitrary resolutions of wavelets IEEE MTT Transactions, Vol.50, No.2, pp.501-516, February 2002.
  21. Bushyager N., McGarvey B., Tentzeris M.M. - Introduction of an Adaptive Modeling Technique for the Simulation of RF Structures Requiring the Coupling of Maxwell's, Mechanical and Solid-State Equations Applied Computational Electromagnetics (ACES) Society Journal, Vol.17, No.1, pp.104-111, March 2002.
  22. Lim K., Pinel S., Davis M., Sutono A., Lee C.H., Heo D., Obatoyinbo A., Laskar J., Tentzeris M.M., Tummala R. - RF-System-On-Package (SOP) for Wireless Communications IEEE Microwave Magazine, Vol.3, No.1, pp.88-99, March 2002.
  23. Li R.L., Tentzeris M.M., Laskar J., Fusco V.F., Cahill R. - Broadband Loop Antenna for DCS-1800/IMT-2000 Mobile Phone Handsets IEEE Microwave and Wireless Components Letters, Vol.12, No.8, pp.305-307, August 2002.
  24. Davis M., Sutono A, Yoon S.W., Mandal S., Bushyager N., Lee C.H., Lim L., Pinel S., Maeng M., Obatoyinbo A., Chakraborty S., Laskar J., Tentzeris M.M., Nonaka T., Tummala R. - Integrated RF Architectures in Fully-Organic SOP Technology IEEE Transactions on Advanced Packaging, Vol.25, No.2, pp.136-142, May 2002.
  25. Staiculescu D., Lim K., Sutono A., Liang H., Tentzeris M.M., Laskar J. - Flip-Chip vs. Wirebond Printed Circuit Design Magazine, pp.12-16, June 2002.