1. Bushyager N., McGarvey B.,Tentzeris M.M. - Adaptive Numerical Modeling of RF Structures Requiring the Coupling of Maxwell's, Mechanical and Solid-State Equations Invited Paper, 2001 ACES Conference, , pp.1-6, Monterey, CA. Best Student Paper Award
  2. Heo D., Sutono A., Chen E., Gebara E., Yoo S., Suh Y., Laskar J., Dalton E., Tentzeris M.M. - A High Efficiency 0.25-umCMOS PA with LTCC Multi-Layer High-Q Integrated Passives for 2.4 GHz ISM Band Proc. of the 2001 International Microwave Symposium, Phoenix, AZ, May 2001, pp.915-918.
  3. Ponchak G.E., Tentzeris M.M., Papapolymerou J. - Coupling Between Microstrip Lines Embedded in Polyimide Layers for 3D-MMICs on Si Proc. of the 2001 International Microwave Symposium, Phoenix, AZ, May 2001, pp.1723-1726.
  4. Bushyager N., Tentzeris M.M., Gatewood L., DeNatale J. - A Novel Adaptive Approach to Modeling MEMS Tunable Capacitors Using MRTD and FDTD Techniques Proc. of the 2001 International Microwave Symposium, Phoenix, AZ, May 2001, pp.2003-2006.
  5. Bushyager N., Tentzeris M.M. - Modeling and Design of RF MEMS Structures Using Computationally Efficient Numerical Techniques Invited Paper, 2001 Electronic Components and Technology Conference, Lake Buena Vista, FL, May 2001, pp.324-327.
  6. Bushyager N., Tentzeris M.M. - RF MEMS: Development of Design Rules
  7. Bushyager N., Obatoyinbo A., Tentzeris M.M., Laskar J. - Multilayer Package Modeling Using the Multiresolution Time-Domain Technique Proc. of the 2001 IEEE AP-S Symposium Boston, MA, July 2001, pp.IV.806-809.
  8. Sutono A., Lee C.H., Obatoyinbo A., Lim K., Tentzeris M.M., Laskar J. - Development of Highly Integrated 3D Microwave-Millimeter Wave Radio Front-End System-on-Package (SOP) Invited Paper, 2001 European GaAs Conference 2001, London, England, September 2001, pp.235-238.
  9. McGarvey B., Tentzeris M.M. - Coupling of Solid-State and Electromagnetic Equations for Simulation of Wireless Packaged Geometries Proc. of the 2001 European Microwave Symposium, London, England, September 2001, pp.217-220.
  10. PonchaK G.E., Papapolymerou J., Tentzeris M.M. - Coupling Between Finite Ground Coplanar Waveguides Embedded in Polyimide Layers for 3D-MMICs on Si Proc. of the 2001 European Microwave Symposium, London, England, September 2001, pp.25-28.
  11. McGarvey B., Cicconetti R., Bushyager N., Dalton E., Tentzeris M.M. - Beowulf Cluster Design for Scientific PDE Models Proc. of the 2001 Annual Linux Showcase, Oakland, CA, November 2001.
  12. Sutono A., Cafaro G., Laskar J., Tentzeris M.M. - Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects IEEE Trans. on Advanced Packaging, Vol.24, No.2, pp.595-603, November 2001.
  13. Tentzeris M.M. - 3G/4G Wireless Suystems: Challenges of the Future in Greek, Pyrforos Review of National Technical University of Athens, November 2001.
  14. Laskar J., Sutono A., Staiculescu D., Lee C.H., Davis M., Lim K., Tentzeris M.M. - Multilayer 3D System-on-Package (SOP) Architectures for Highly Integrated Microwave and Millimeter Wave Radio Front-End Proc. of 2001 SMTA Conference, Chicago, IL, September, 2001.
  15. Staiculescu D., Sutono A., Laskar J. - Wideband Scaleable Electrical Model for Microwave/Millimeter Wave Flip-Chip Interconnects IEEE Advanced Packaging Transactions, pp. 255-259, September 2001.