1. Tentzeris M.M., Staiculescu D., Cafaro N.G., Laskar J. - Design and Optimization of Novel RF Packaging Structures Using Multiresolution and Statistical Schemes Invited Paper, PIERS 2000, Boston, MA, July 5-14, 2000, p.384.
  2. Bushyager N., McGarvey B., Tentzeris M.M. - Modeling of Photonic Bandgap (PBG) Devices Using MRTD Adaptive Schemes Invited Paper, PIERS 2000, Boston, MA, July 5-14, 2000, p.58.
  3. Ponchak G.E., Tentzeris M.M. - Development of finite ground coplanar (FGC) waveguide 90 degree crossover junctions with low coupling Proc. of the 2000 IMS Symposium, Boston, MA, June, 2000, pp.1891-1894.
  4. Bushyager N., Tentzeris M.M. - Characterization of micromachined transmission lines using MRTD Proc. of the 2000 IMS Symposium, Boston, MA, June, 2000, pp.251-254.
  5. Sutono A., Cafaro N.G., Laskar J., Tentzeris M.M. - Experimental study and modeling of microwave bond wire interconnects Proc. of the 2000 AP-S Symposium, Salt Lake, UT, July, 2000, pp.2020-2023.
  6. McGarvey B., Staiculescu D., Tentzeris M.M., Laskar J. - Adaptive Modeling of Complex Packaging Geometries Using Haar-based MRTD Algorithms Proc. of the 2000 European Microwave Conference, Paris, France, October, 2000, pp.413-416.
  7. Laskar J., Tentzeris M.M., Sutono A., Liang H., Bushyager N. and Lim K. - Next Generation Packaging Architectures for Highly Integrated Wireless Systems Proc. of the 2000 European Microwave Conference, Paris, France, October, 2000, pp.136-139.
  8. Staiculescu D., Laskar J., Tentzeris M.M. - Flip Chip Design Rule Development for Multiple Signal and Ground Bump Configurations Proc. of the 2000 Asia-Pacific Microwave Conference Sydney, Australia, December, 2000,pp.136-139.
  9. Staiculescu D., Laskar J., Tentzeris M.M. - Design Rule Development for Microwave Flip-Chip Applications IEEE MTT Transactions, Vol.48, No.9, pp.1476-1481, September 2000.
  10. Tentzeris M.M. - Numerical Techniques in RF and Microwave Design Invited Section for the Book: "The RF and Microwave Handbook" edited by M.Golio, pp.8.13-8.34, CRC Press, 2000.
  11. Laskar J., Tentzeris M.M., Schutt-Aine J., Tummala R. - Fundamentals of RF Packaging Invited Chapter for the Book:"Fundamentals of Microsystems Packaging" edited by R.Tummala, pp.500-541, McGraw-Hill, 2001.
  12. Staiculescu D., Sutono A., Laskar J. - Wideband Scaleable Electrical Model for Microwave/MIllimeter Wave Flip-Chip Interconnects Proc. of the 2000 EPEP Topical Meeting, Scottsdale, AZ, 2000, pp. 99-102.