Jong Hoon Lee received the B.S. Degree in electrical engineering from The Pennsylvania State University, Universtiy Park, PA with high honor in the spring of 2001.Since then he joined in electrical engineering at The Georgia Institute of Technology, GA in the fall of 2001. He received the M.S. degree in 2004 and is currenlty working toward Ph.D. degree under the adivce of Prof. Manos M. Tentzeris.

His research interests are packaging technologies for microwave/mmW systems, passive/active circuits for RF/wireless systems, DSP-based predictors to improve the computational efficiency of the simulation of highly resonant RF geometries. He also researches FDTD/Spice interface and active devices modeling with FDTD and MRTD. He is currently researching the development of LTCC system-on-package (SOP) module for millimeter-wave wireless systems. He is a member of the Georgia Tech ATHENA research group, NSF packaging research center, the Georgia Electronic Design Center, Atlanta, GA and Tau Beta Pi Honor association.

Conference Papers (published with ATHENA)

2005

1. Lee J.H., Bushyager N., Tentzeris M.M. - Comparative Study of DSP Techniques for the Effective Modeling and Design of Highly Complex RF-MEMS Structures Procs. of the 2005 IEEE CEM-TD Workshop, pp.88-91, Atlanta, GA, September 2005.

Journal Papers (published with ATHENA)

2004

1. Tentzeris M.M., Laskar J., Papapolymerou J., Thompson D., Pinel S., Li R.L., Lee J.H., DeJean G., Sarkar S., Pratap R., Bairavasubramanian R., Papageorgiou N. - RF SoP for Multi-band RF and Millimeter-wave Systems Advanced Packaging Magazine, pp.15-16, April 2004.